Manufacturing Challenges In Electronic Packaging

by Lee, C Y

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Manufacturing Challenges in Electronic Packaging

by Y.C. Lee

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New
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Hard Cover
ISBN
9780412620300
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Uxbridge, Greater London, GBR
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CA$179.38

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Hard Cover. New. New Book; Fast Shipping from UK; Not signed; Not First Edition; The Manufacturing Challenges in Electronic Packaging.
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CA$179.38
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Manufacturing Challenges in Electronic Packaging

by Y. C. Lee

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New
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Hardback
ISBN
9780412620300
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1
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Southport, Merseyside, GBR
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Hardback. New. About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements.
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CA$184.49
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Manufacturing Challenges in Electronic Packaging

by Y.C. Lee

Condition
New
ISBN
9781461376590
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1
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Uxbridge, Greater London, GBR
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This seller has earned a 5 of 5 Stars rating from Biblio customers.
Item Price
CA$179.38

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Description:
New. New Book; Fast Shipping from UK; Not signed; Not First Edition; The Manufacturing Challenges in Electronic Packaging.
Item Price
CA$179.38
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Manufacturing Challenges in Electronic Packaging

by Lee, Y.C. [Editor]; Chen, W.T. [Editor];

Condition
New
Binding
Hardcover
ISBN
9780412620300
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1
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campbelltown, Florida, USA
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CA$289.13

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Springer. hardcover. New. 6x0x9. Brand New Book in Publishers original Sealing
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CA$289.13